Future Assembly Solutions
Future Hardware Technology
Reliable Contract Manufacturing

Every board is inspected by our AOI machine to ensure the highest quality possible. We conform to requirements for handling Electrostatic Discharge (ESD) sensitive devices. We have a controlled ESD floor and ESD hand and foot devices.


All material is built to IPC-A 610 and IPC-A 620 workmanship standards under ISO 9001 requirements.

PCB Assembly

Complete PCBA and Box Build Assemblies:


In our ITAR and ISO certified facilities, we can handle BGA, Full SMT and thru hole requirements. 

Capabilities and services include:
  • Complete TPH (thru pin hole) capability ROHS and Non-ROHS
  • Complete capability, which includes BGA, 0402 and other types of component placement. 
  • Complete capability, which includes BGA, 0402 and other types of component placement. 
  • Physical sizes on PCB can range from 1”X1” to 14.5" X 19.5” through our standard process.
  • For any size above or below the standard size, we will handle with our special process capabilities. 
  • Local manufacturing which makes our lead time for prototype 1 to 5 days
  • Lead time of two weeks for mid volume
  • Turnkey or consigned
  • Minimum order quantities of 1 piece apply